DISPERBYK® is a wetting and dispersing additive for solvent-borne systems . It is composed of a solution of a copolymer with acidic groups. This prod. Solution of a copolymer with acidic groups. Acts as a wetting and dispersing additive for aqueous and solvent-borne systems. Provides deflocculation through . Material Safety Data Sheet. DISPERBYK Version Revision Date 08/14/ Print Date 08/14/ 1 / SECTION 1. PRODUCT AND COMPANY.
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Metallic nanoparticles may have an oxide layer on their surface. In some cases, the dispersant that provides the best performance at one step of the process may not provide the best performance at another step.
Copper, with a resistivity of 1. In some ink formulations, for example, an effective weight percentage of dispersant may disperbgk in a range from about 0. Also, because the surface tension of solvent- and water-based inks may be different, different additives and modifiers may be needed to maintain the desired contact angle between the ink and the substrate.
The ink of claim 1further comprising a rheology modifier. The carrier may be, for example, water, an organic solvent, or any combination thereof. I have made myself a promise to ensure that employers’ and the public are provided with the necessary knowledge and tools eisperbyk make their workplaces safer. In metallic inks and pastes, stabilizing agents may be added in small quantities to avoid significant increases in the resistivity of conductors cured from these materials.
About Careers Team Contact Us. Surface preparation to eliminate whisker growth caused by plating process interruptions. Nanoparticle dispersion may also be enhanced by dispergyk a surface of a dixperbyk nanoparticle. The pH of the dispersion may be from about 1 to about Find out how we can help here.
The ink of claim 16wherein the dispersant disoerbyk selected from the group consisting of amines, polyvinylpyrrolidone, polyethylene glycol, isostearyl ethylimidazolinium ethosulfate, oleyl ethylimidazolinium ethosulfate, and any combination thereof.
Unlike the insulating residues of common dispersants, conductive organic compounds such as conductive polymers may not act as an insulating defect in the metallic conductors, but instead may act as a parallel-serial resistor R 2 with a metallic conductor R 1. Lead frame and a method of manufacturing a semiconductor device and a semiconductor device using the same.
During photosintering, metallic nanoparticles are adhered disprrbyk during photonic curing to form metallic films. Conductive ink composition and method of forming a conductive pattern using the same. It reduces haze in inorganic pigmented coatings when application occurs by electrostatic spraying. A water-based ink including copper nanoparticles and glyoxylic acid or oxalic acid was prepared. Conductive ink composition for inkjet printer, method for forming diaperbyk pattern by inkjet printing and printed cirsuit board using the method.
The solution was agitated for at least 20 minutes to break up any agglomerated copper nanoparticles and to mix the dispersion. After de-agglomeration, dispersion stability may be maintained by achieving a balance between attractive and repulsive forces in an ink formulation. Fine metal particles and fine metal oxide particles in dry powder form, and use thereof. Modifiers and additives may also be used to enhance ink shelf life stability, final cured resistivity, and coating appearance. Dispersion comprising metallic, metal oxide or metal precursor nanoparticles, a polymeric dispersant and a sintering additive.
In some implementations, the polymeric dispersant may be ionic, non-ionic, or any combination of ionic and non-ionic polymeric dispersants.
DISPERBYK (KGS/DRUM) – Suka Chemicals
In an implementation in which ionic polythiophene conducting polymers are used to prepare aqueous metallic inks, the positive charge may be located within a polythiophene network. Multi-phase coatings for inhibiting tin whisker growth and methods of making and using the same. Coverage of less than a monolayer leaves open sites on the nanoparticle that may cause agglomeration.
Bismuth composition, method of electroplating a tin-bismuth alloy and electroplating bath therefor. It should be appreciated by those of skill in the art that the techniques disclosed in the examples that follow represent techniques discovered by the inventors to function well in the practice of the invention, and thus may be considered to constitute exemplary modes for its practice.
In some implementations, the solvent includes water, an organic solvent, eisperbyk any combination thereof. The conductive disperbbyk may include a stabilizing agent, an adhesion promoter, a surface tension modifier, a defoaming agent, a leveling additive, a rheology modifier, a wetting agent, an ionic strength modifier, or any combination thereof. Intumescent paint coatings for inhibiting tin whisker growth and methods of making and using the same.
Substrates with a high surface energy, including flexible substrates such as polyimide, require different additives and modifiers than substrates with a low surface energy, such as glass, silicon, or low surface energy polymeric substrates. The present invention is related to conductive inks. Curing methods include an optical flash system, a pulsed laser with suitable wavelengths, and other short-pulsed lamps.
It is a silicone-free surface additive for aqueous systems. Dispersants with a high hydrophile-lipophile balance HLB may be used with aqueous dispersions, and dispersants with a low HLB may be used with dispersions in non-polar organic liquids. A dispersion comprising metallic, metal oxide or metal precursor nanoparticles, a polymeric dispersant and a sintering additive. Photovoltaic thin-film cell produced from metallic blend using high-temperature printing.
A weight ratio of 1100